Electrical interconnections
Presentation of the paper [B62]

[B62] F. Broydé, E. Clavelier, "A New Method for the Reduction of Crosstalk and Echo in Multiconductor Interconnections", IEEE Trans. Circuits Syst. I, Vol. 52, No. 2, February 2005, pp. 405-416.

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     Some corrections applicable to this paper may be found in:

[B65] F. Broydé, E. Clavelier, "Corrections to « A New Method for the Reduction of Crosstalk and Echo in Multiconductor Interconnections »", IEEE Trans. Circuits Syst. I, Vol. 53, No. 8, August 2006, p. 1851.

Downloading the document as a .pdf file (44 ko). This document is subject to the Copyright of Excem and of the IEEE.

     The results of the paper [B62] have been later used by other authors and researchers, for instance in the articles:

• C.-M. Jo, Y.-S. Eo, "A new TWA-based efficient signal integrity verification technique for complicated multi-layer RLC interconnect lines", Journal of the Institute of Electronics Engineers of Korea, SD, Semiconductor and devices, Vol. 43, Issue 7, July 2006, pp. 20-28 (in Korean).
• M. Bartolini, P. Pulici, P.P. Stoppino, G. Campardo, G.P. Vanalli, "A reduced output ringing CMOS buffer", IEEE Trans. Circuits Syst. II, Vol. 54, No. 2, February 2007, pp. 102-106.
• S. Roblot, A. Zeddam, A. Reineix, "On eliminating crosstalk in a multiconductor telecommunication cable", Proceedings of the 2007 IEEE International Symposium on Electromagnetic Compatibility, 8-13 July 2007, Honolulu, Hawaii.
• T. Ciamulski, W.K. Gwarek, "Coupling compensation concept applied to crosstalk cancelling in multiconductor transmission lines", IEEE Trans. Electromagn. Compat., Vol. 50, No. 2, May 2008, pp. 437-441.
• Y. Choi, H. Braunisch, K. Aygün, P.D. Franzon, "Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects", Proceedings of the 58th Electronic Components and Technology Conference, ECTC 2008, 23-27 May 2008, pp. 664-668.
• Y. Choi, C. Won, P.D. Franzon, H. Braunisch, K. Aygün, "Multimode Signaling on Non-Ideal Channels", Proceedings of the IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2008, 27-29 October 2008, pp. 51-54.
• P. Milosevic, J.E. Schutt-Ainé, N.R. Shanbhag, "DSP-based Multimode Signaling for FEXT Reduction in Multi-Gbps Links", Proceedings of the IEEE 18th Topical Meeting on Electrical Performance of Electronic Packaging and Systems, EPEPS 2009, October 19-21, 2009, Tigard, OR, USA, pp. 45-48.
• Y. Lin, X. Zou, Z. Zheng, W. Huo, X. Chen, W. Kang, "High-speed Low Switching Noise and Load Adaptive Output Buffer", Proceedings of the 12th International Symposium on Integrated Circuits, ISIC-2009, 14-16 December 2009, Singapore, pp. 280-282.
• Y. Lin, J. Zhang, X. Zou, D. Liu, S.-Y. Wang, "Design of output buffer with low switching noise and load adaptability", Analog Integrated Circuits and Signal Processing, Vol. 65, No. 2, April 2010, pp. 273-282.
• Y. Choi, H. Braunisch, K. Aygün, P.D. Franzon, "Multimode Transceiver for High-Density Interconnects: Measurement and Validation", Proceedings of the 60th Electronic Components and Technology Conference, ECTC 2010, 1-4 June 2010, pp. 1733-1738.
• P. Milosevic, J.E. Schutt-Ainé, W.T. Beyene, "Crosstalk Mitigation of High-Speed Interconnects with Discontinuities Using Modal Signaling", Proceedings of the IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, October 24-27, 2010, Austin, TX, USA, pp. 21-24.
• B. Xue, X. Lei-Jun, "Research on the Effects of Substrates on the Crosstalk in Microstrips", Journal of Electronics and Information Technology, Vol. 32, No. 11, November 2010, pp. 2768-2771 (in Chinese).
• I.E. Samotin, A.M. Zabolotsky, T.R. Gazizov, R.V. Kirichek, "The usage of a flat power cable as a protective device againts ultra short pulses", Proceedings of Tomsk state university of control systems and radioelectronics, No. 1, Part 2, vol. 21, 2010, pp. 74-79 (in Russian).
• J. Lee, S. Lee, S. Nam, "A crosstalk reduction technique for microstrip MTL using mode velocity equalization", IEEE Transactions on Electromagnetic Compatibility, Vol. 53, No. 2, May 2011, pp. 366-371.